MiR300 Autonomous Mobile Robot
The MiR250 is a more flexible AMR that can work around the clock and is brilliantly simple to setup, for improved productivity. Its smaller footprint and increased adaptability help optimize internal logistics without changing layout.
The MiR250 has a footprint of 580 x 800 mm and a height of only 30 centimeters while still being able to move as much as 250 kg with a speed of 2 meters/second. This makes the AMR more agile than any other AMRs on the market and highly adaptable for challenging environments. Thanks to the small footprint, it can drive in spaces as narrow as 80 centimeters. So, doors and elevators that can be an obstacle for other mobile robots, are not a problem for the MiR250.
The MiR250 is constructed for a long lifetime, easy serviceability, and works 24/7 with the option for a fast battery swap. Further, it has been designed according to current applicable safety standards – we, therefore, believe it is the safest AMR on the market. The MiR250 also comes in an ESD version.
Designated use for internal transportation of goods and automation of internal logistics
Type: Autonomous Mobile Robot (AMR)
Color: RAL 7011 / Iron Grey
Color ESD version: RAL 9005 / Jet Black
Cover material: Polycarbonate, Lexan Resin 221R
Product design life: Five years or 20 000 hours, whichever comes first
Length: 800 mm / 31.5 in
Width: 580 mm / 22.8 in
Height: 300 mm / 11.8 in
Ground clearance: 25 – 28 mm / 1.0 – 1.1 in
Weight (without battery or payload): 83 kg / 183 lbs (MiR250 Shelf Carrier: 146 kg)
Load surface: 800 x 580 mm / 31.5 x 22.8 in
Wheel diameter (drive wheel): 200 mm / 7.9 in
Wheel diameter (caster wheel): 125 mm / 4.9 in
Dimensions for mounting top modules: Robot footprint. Contact MiR if a bigger top module is required.
Top plate: Anodized aluminum, 5 mm / 0.2 in
Height with MiR Shelf Carrier 250: 370 mm / 14.6 in
Weight width MiR Shelf Carrier 250: 146 kg / 321 lbs
Maximum payload: 250 kg / 551 lbs
Acceleration limits with payload: 0.3 m/s^2
Footprint of payload: Robot footprint. Contact MiR if a bigger payload footprint is required.
Payload placement: COM position according to User guide
